aic1993 linear fan control driver ic analog integrations corporation si-soft research center ds-1993g-01 20100422 3a1, no.1, li-hsin rd. i , science park , hsinchu 300, taiwan , r.o.c. tel: 886-3-5772500 fax: 886-3-5772510 www. analog.com.tw 1 ? features z vout follows 1.6 times of vset z 150mv dropout at 500ma output current z over current and over temperature protection z enable function z 5ua quiescent current in shutdown mode z sop-8 package ? applications z notebook pc z pc motherboard z battery powered systems z peripheral cards ? general description the aic1993 is a high performance positive linear voltage regulator designed for applications requir- ing low dropout voltage at maximum 500ma output current. the aic1993 vo output voltage follows 1.6 times of vset voltage until it reaches vin vol- tage. the vset voltage must be larger than 1v to guarantee vout as 1.6 times of vset voltage. an enable pin can be used to reduce power dissipa- tion in shutdown mode. the aic1993 provides ex- cellent line and load regulation. the aic1993 is available in sop-8 package. ? typical application circuit fan typical application circuit
aic1993 2 ? ordering information packing type tr: tape & reel tb: tube packaging type s8 : sop-8 p: lead free c ommercial g: green package example: aic1993ps8tr ? in sop-8 lead free package & taping & reel packing type aic1993g8tr ? in sop-8 green package & tap in g & reel packin g t yp e pin configuration sop -8 top view gnd gnd gnd gnd vo vin vs et e n 1 3 4 2 8 6 5 7 a ic1993xxxxx ? absolute maximum ratings vin, en, vset to g nd ....................................................................................................... -0 .3v to +6v ouput switch curr ent .. ................................................??????......................................... 500ma operating junction te mperature ........................... ?????????????.................... 125 c operating ambient temperature range .......................??????. ? ?......................... -40~85 c maximum storage temperature r ange ......................................................................... -65 c to 150 c maximum lead temperatur e (soldering 10s) .............................................................................. 260 c thermal resistance junction to case sop8?..???..???..????????..???? 40 c/w thermal resistance junction to ambient sop8?..???..???????????????.160 c/w (assume no ambient airflow) ? test circuit refer to typical application circuit.
aic1993 3 ? electrical characteristics (v in =5v, v en =5v, v set =2v, c in =c out =2.2 f, t a = t j =25 q c, unless otherwise specified.) (note1) parameter test conditions symbol min. typ. max. units operating voltage v in 4.5 5.5 v quiescent current v o = 5v 0.5 ma shutdown supply current v en = 0 5 30 a output voltage/v set vol- tage v in = 5.5v, v set = 1v to 3.2v 1.552 1.6 1.648 v/v line regulation v in = 4.5v to 5.5v 0.2 0.5 % load regulation 10ma Q i o Q 500ma 0.5 0.8 % output resistance i o = 500ma, v set = 3.4v 0.2 0.3 short circuit current 0.3 a minimum v set voltage 1 v v set pin current 80 200 na v en voltage high 1.6 v v en voltage low 0.4 v v en pin bias current v en = 0 1.5 10 a thermal-shutdown thre- shold +150 thermal-shutdown hystere- sis 20 note 1: specifications are production tested at ta=25 q c. specifications over the -40 q c to 85 q c operating temperature range are assured by design, characteriza tion and correlation with statistical quality controls (sqc).
aic1993 4 ? typical performance characteristics v in =v en =5v, v set =2v, i out =0.5a, c in = 4.7 f, c out =10 f, t a = t j =25 q c fig.1 load transient response fig.2 start-up fig.3 short circuit current fig.4 overcurrent protection characteristics fig.5 quiescent current vs. vin fig.6 quiescent current vs. temperature
aic1993 5 fig.7 output voltage vs. temperature fig.8 output voltage vs. v in 0.00.51.01.52.02.53.0 0 1 2 3 4 5 6 v in =5.5v v out (v) v set (v) fig.9 dropout voltage vs. iout fig.10 vout vs. v set
aic1993 6 ? block diagram functional block diagram of aic1993 ? pin descriptions pin 1: ven: enable input. pulling this pin under 0.4v turns the regulator off, reducing the quiescent current to a fraction of its operating value. the device will be enabled if this pin is left open. connect to vin if not being used. pin 2: vin: power input pin. supply the power to the ic. pin 3: vo: the pin is the power output of the regulator. its voltage is 1.6 times of vset. pin 4: vset: this pin sets the output voltage. its voltage must be larger than 1v to guarantee vo as 1.6 times of vset. pin 5: gnd: reference ground. us e all four pins on the sop-8 device. pin 6: gnd: reference ground. us e all four pins on the sop-8 device. pin 7: gnd: reference ground. us e all four pins on the sop-8 device. pin 8: gnd: reference ground. us e all four pins on the sop-8 device.
aic1993 7 ? application informations input-output capacitors linear regulators require input and output capa- citors to maintain stability. input ceramic capaci- tor at 2.2 f with a 2.2uf output ceramic capaci- tor is recommended. en en is used to make system enable and disable. it supply to output voltage in shutdown logic mode of fan control. vset the output voltage control pin has 1.6 time be- come the output voltage. voltage limilt form 0v to 3.125 v like to feedback control resistance in internal r1 and r2 modulation. power dissipation the maximum power dissipation of aic1993 depends on the thermal resistance of its case and circuit board, the temperature difference be- tween the die junction and ambient air, and the rate of airflow. the rate of temperature rise is greatly affected by t he mounting pad configura- tion on the pcb, the board material, and the ambient temperature. when the ic mounting with good thermal conductivity is used, the junc- tion temperature will be low even when large power dissipation applies. the power dissipation across the device is p = i out (v in -v out ). the maximum power dissipation is: )r (r )t(t p ba jb aj max + ? = where t j -t a is the temperature difference be- tween the die junction and the surrounding air, r jb is the thermal resistance of the package, and r ba is the thermal resistance through the pcb, copper traces, and other materials to the surrounding air. as a general rule, the lower temperature is, the better reliability of the device is. so the pcb mounting pad should provide maximum thermal conductivity to maintain low device temperature. gnd pin performs a dual function of providing an electrical connection to ground and channeling heat away. therefore, connecting the gnd pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature.
aic1993 8 ? physical dimensions (unit: mm) z sop-8 package outline drawing note: information provided by aic is believed to be accurate and reli able. however, we cannot assume responsibility for use of any circuitry other than circuitry entirely em bodied in an aic product; nor for any infringement of patents or other rights of thir d par- ties that may result from its use. we reserve the right to change the circuitry and spec ifications without notice. life support policy: aic does not authorize any aic product for us e in life support devices and/or systems. life support device s or systems are devices or systems which, (i) are intended for surgical implant into the body or (ii) support or sustain life, a nd whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonabl y expected to result in a significant injury to the user. note: 1. refer to jedec ms-012aa. 2. dimension "d" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. dimension "e" does not include inter-lead flash or protrusions. 4. controlling dimens ion is millimeter, converted inc h dimensions are not necessarily exact. a l view b 0.25 seating plane section a-a base metal gauge plane with plating a1 b c d e aa h e h x 45 see view b h l d e h e c b a1 0.50 0.25 0.40 0 1.27 8 1.27 bsc 4.80 5.80 3.80 0.33 0.19 0.10 5.00 6.20 4.00 0.51 0.25 0.25 s y m b o l a sop-8 millimeters 1.35 min. 1.75 max.
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